1.High-intensity ultraviolet irradiation increase throughput
2.Min. 300mW/cm²
3.Wafer size:300/200mm
4.Radiation distribution:Max. +-10%(measured at 5 points on a wafer in H mode)
5.Clean，fast wafer handling
6.Space-saving design
7.Complete safety design
8.Product temperature <60°C
9.Can dock into customer's production line
|
ITEM |
Specification |
|
Wafer size |
Φ300/200/150mm |
|
M/C size (WxDxH) |
180 X 190 X 220 cm |
|
Power supply |
AC 380V/220V 50/60Hz 3 Φ |
|
Irradiance |
Min. 650mW/cm² (at wavelengths ranging from220 to 450nm) |
|
Wafer transfer mechanism |
Wafer robot(RWSE/RWDE) |
|
LOAD PORT |
Manual / Auto |
|
Method for setting process condition |
PC BASE MMI |
|
Certified |
SEMI S2(option) |
Main Application:
1.FOPLP packaging wafer UV curing process
2.Wafer surface glue/ink UV curing process
3.Temporary bonding and debonding process
4.Advanced fan-out packaging process
