1.Industry's first integrated heating / cooling porous ceramic chuck
2.Three-zone Temp. control design,uniformity UP
3.High throughput
1.Wafer-level thermo bonding
2.Electrical conductivity endurance test of wafers while being heated
| Items | Specifications |
| Size |
12/8/6 inch |
|
Pore diameter range |
15-40um |
|
Porous material |
SiC |
|
Insulation material |
10^6 ~10^9 Ω |
|
Temp.distributions |
±2 ℃ (depends on the specification) |
|
Temp. setting range |
200℃ |
