1.Rapid heating；Temp.rise rate ≧2℃
2.Rapid cooling；Temp.cooling rate ≧3℃
3.High throughput
4.Base material: Aluminum alloy
5.Operating Temp. To 250℃
6.Temp. uniformity to ±3 % (250℃)
|
ITEM |
Specification |
|
Wafer size |
Φ300/200/150mm |
|
Module size (WxDxH) |
Max Φ320mm |
|
Stage thickness |
20mm |
|
Power supply |
AC 220V 50/60Hz 1 Φ |
|
Max.hot plate temperature |
250℃ |
|
Temperature setting range |
50-250℃ |
|
Temperature rise rate |
≧2.0℃/sec |
|
Temperature cooling rate |
≧3.0℃/sec |
Main Application:
1.Wafer rapid heating / cooling module , improve throughput
2.Thin product application for other industries (glass)
Equipment Feature:
1.Stage design with integrated heating / cooling
2.Withstand thermal shock deformation design
3.Wafer vacuum adsorption design
4.High-precision surface processing
5.The control box can be matched with the customer's main system
contact
JOE
0919844561 / (04) 25378884 ext:28403
SU
(04) 25378884 ext:28340
